The Intel Mycro Direct-Die Pro RGB V1 is equipped with a jet system on the cooler surface and the cooling channel slot width has been optimized. The coldplate of the cooler is made of nickel-plated copper and is mounted directly on the CPU chip. To do this, the Integrated Loading Mechanism (ILM) of the mainboard is removed and the processor must be delidded. The nickel-plating of the cooler plate creates a barrier layer so that gallium-based liquid metal cannot diffuse into the copper and multiple applications of liquid metal are generally not necessary.

• Water cooler for direct-die mounting
• Nickel-plated copper microfin cooler
• Replaces ILM and heatspreader
• Cover made from CNC-milled POM
• G1/4-inch fittings
• Only for delidded CPUs!

Between the coldplate and the cover made of anodized aluminium is acrylic glass, which is subjected to a annealing process after milling, which relieves the acrylic glass of internal stresses. This ensures that no stress cracks form in the acrylic glass even after a long period of use, as can occur with tempered acrylic glass. RGB LEDs are located under the aluminum cover, which are controlled via the mainboard via a 3-pin ARGB header (+5V/DATA/GND). The LEDs illuminate the acrylic glass under the lid and the G1/4-inch connections in the lid.

Note on the use of KryoSheet

The Intel Mycro Direct Die Pro V1 has been extensively tested internally in various application scenarios. During development, great emphasis was placed on stable operation of the processor and RAM. For example, the Intel Mycro Direct Die Pro V1 is mounted in such a way that the outer edges of the cooler do not rest on the mainboard. In our test series, KryoSheet in combination with the Intel Mycro Direct Die Pro V1 was unable to achieve any significant improvements in terms of temperature and was problematic in terms of contact pressure. For this reason, we cannot recommend thermal pads because their additional thickness has a strong influence on the contact pressure and can therefore impair the function.

Compatibility note

The Intel Mycro Direct Die Pro V1 is compatible with the following processors:

• Intel 12th Gen CPUs
• Intel 13th Gen CPUs
• Intel 14th Gen CPUs

Attention: Removing the heatspreader (“delidding”) of a processor is at your own risk! The manufacturer's warranty expires when the CPU is delidded! Damage caused by delidding the CPU is not covered by the manufacturer's warranty! Removing the Integrated Loading Mechanism (ILM) of the motherboard may invalidate the manufacturer's warranty!